doc. no : qw0905- rev. : date : round type led lamps data sheet LSR3333-8KL ligitek electronics co.,ltd. property of ligitek only 22 - jun. a - 2008 LSR3333-8KL lead-free parts pb
+ - 60 30 75% 50% 0 25%100% -30 25% 75%50% 100% -60 0 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation package dimensions ligitek electronics co.,ltd. property of ligitek only 2.54typ 1.0min LSR3333-8KL part no. 8.6 7.6 25.0min 0.5 typ 1.5max 5.9 5.0 1/5 page
water clear page 2/5 part no. LSR3333-8KL ligitek electronics co.,ltd. property of ligitek only unit ma ma " a # # mw 15 70 red ratings 10 ir -40 ~ +85 -40 ~ +100 50 viewing angle 2 $ 1/2 (deg) 20 min. min. forward voltage @ ma(v) typ. lens peak wave length % pnm spectral halfwidth &% nm 450 20 660 luminous intensity @20ma(mcd) 700 typ. forward current peak forward current duty 1/10@10khz parameter operating temperature storage temperature reverse current @5v power dissipation emitted part no material typical electrical & optical characteristics (ta=25 # ) symbol t opr tstg i f pd i fp absolute maximum ratings at ta=25 # note : 1.the forward voltage data did not including ! 0.1v testing tolerance. 2. the luminous intensity data did not including ! 15% testing tolerance. color LSR3333-8KL gaalas red 1.52.1 20
part no. LSR3333-8KL page 3/5 ligitek electronics co.,ltd. property of ligitek only 2.5 3.0 100 10 forward current(ma) 1.5 2.0 0.5 1.0 1.0 0.0 5.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.2 relative intensity vs. forward current 1000 3.0 2.0 1.0 1.5 2.5 fig.4 relative intensity vs. temperature 80 60 20 040 0.0 -40 80100 ambient temperature( ) -20 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.5 100 750 1000 sr chip 3.0 2.0 1.0 forward voltage(v) 1.0 10 0.1 f o r w a r d c u r r e n t ( m a ) 100 1.2 1.1 0.9 1.0 204060 -40-200 0.8 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 700 600650 0.0 0.5 wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a 1.0 fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) typical electro-optical characteristics curve fig.1 forward current vs. forward voltage 4.0
part no. LSR3333-8KLpage 4/5 soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile temp( c) 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 5 /sec max 100 150 time(sec) 120 preheat 50 25 0 0 2 /sec max note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 260 60 seconds max
part no. LSR3333-8KL page 5/5 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard test item operating life test test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) reliability test: ligitek electronics co.,ltd. property of ligitek only description this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 high temperature storage test low temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. solderability test 1.t.sol=230 5 2.dwell time=5 1sec 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles thermal shock test the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
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